Renesas Electronics Showcases Latest IoT Solutions Enabling Smart City at IoT ASIA 2018

Renesas Electronics Showcases Latest IoT Solutions Enabling
Smart City at IoT ASIA 2018
Visit Booth #D05 to Explore Renesas’ Innovative Solutions for Connectivity, HMI, Cloud Services, Smart Home/Building Automation and More

SINGAPORE, March 21, 2018 Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, will showcase a variety of IoT solutions and expertise at IoT ASIA 2018, to be held at Singapore Expo Hall 3 on March 21-22, in Singapore. Demonstrations in booth #D05 will highlight the company’s high-performance and cost-efficient solutions designed to enable a smart city. These include the Renesas SynergyEnterprise Cloud Toolbox with AE-CLOUD1 Kit, the RX65N Envision kit for HMI applications, and a DCPLC networking demonstration based on the powerline communication modem solution for  building automation.
Technology highlights at Renesas booth include:
               The Renesas Synergy Enterprise Cloud Toolbox is a software Application Project that together with the Synergy AE-CLOUD1 kit provides a reference design and starting point for users to quickly connect to enterprise clouds such as Microsoft Azure™, Amazon Web Services™, and Google Cloud Platform. Renesas will highlight the ability to setup the Synergy Enterprise Cloud Toolbox with AE-Cloud1 kit to run on Singtel’s Cat-M1 cellular network securely within ten minutes. System developers can leverage this comprehensive environment to achieve quicker and easier progress from evaluation stage to development and production stages when connected to Singtel Cat-M1/NB-IoT services.

               The RX65N Envision Kit based on the RX65N Group of microcontrollers (MCUs) allows quicker and easier evaluation for cost-efficient Human Machine Interface (HMI) applications. 

The kit displays four different pre-installed demonstrations: The 2D Drawing Engine demo and the Bouncing Balls demo display how 2D accelerators enable smoother motion graphics. The Mandelbrot demo shows how using the floating-point unit (FPU) of the RXV2-core enables much quicker calculation of the Mandelbrot. The bank swap demo displays firmware updating using the RX65N MCU’s new dual bank flash with BGO (background operation) function. 
The kit includes all the tools necessary for development, including board circuit diagrams and demonstration source code, which makes it ideal to be used as reference during project development. System developers using the RX65N MCU can benefit from SEGGER emWin GUI software as well as supporting tools without any additional costs.

               The DC-PLC networking demonstration highlights how to simplify and reduce cost for direct current (DC) network system development by deploying a PLC networking topology for controlling lighting, air-conditioning, systems, and multiple environmental sensors in a building automation environment – using a single 24V DC power cable.

About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live—securely and safely. A global leader in microcontrollers, analog, power and SoC products and integrated platforms, Renesas provides the expertise, quality, and comprehensive solutions for a broad range of Automotive, Industrial, Home Electronics, Office Automation and Information Communication Technology applications to help shape a limitless future. Learn more at

(Remarks) Renesas Synergy is a trademark of Renesas Electronics Corporation. Amazon Web Services is a trademark of, Inc. or its affiliates in the United States and/or other countries. Google Cloud Platform is a trademark of Google Inc. Microsoft Azure is a trademark of Microsoft Corporation. G3-PLC is a trademark of Maxim Integrated Products, Inc. All registered trademarks or trademarks are the property of their respective owners.  

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