[CES 2025] Intel expands Core Ultra 200S family with new non-K variants at 11 SKUs

Intel's Arrow Lake-S CPUs represent a significant shift in Team Blue's design philosophy, moving away from its traditional "anything for the highest boost clock" approach in favor of prioritizing power efficiency. This shift was already evident in last year's unlocked SKUs, and at CES 2025, Intel introduced the non-K models aimed at the mainstream market. The Arrow Lake-S lineup spans configurations from 10 to 24 cores. While the boost clock frequencies and cache differ across the models, they share the same memory capacity support and PCIe lane allocation. These include 16 PCIe 5.0 lanes for GPUs, 4 PCIe 5.0 lanes for SSDs, and an additional 4 PCIe 4.0 lanes for slower, low-power devices. Notably, Intel is phasing out support for CUDIMMs, considering them unnecessary for the target user base. In terms of AI capabilities, these processors deliver between 19 and 36 TOPS. However, this performance falls short of the requirements for Microsoft's Copilot+ PCs, limiting compatibility with certain advanced Windows 11 features. For users relying on the integrated GPU during the transitional period before the arrival of 2025 GPUs, the processors offer up to a 4-core Xe2 LPG iGPU configuration. Additionally, users can benefit from up to two Thunderbolt 4 ports, DisplayPort 2.1, and HDMI 2.1 outputs.

Model	Cores (P+E)/Threads	Boost Clock (P/E) GHz	TOPs	Smart Cache	TDP	Deep Learning Boost Support	Max RAM	GPU Cores / TOPS	PCIe Lanes
Core Ultra 9 285T	8+16 / 24	5.4 / 4.6	36	36MB	65W-182W	Yes	192GB DDR5-6400	4 / 8	24
Core Ultra 9 285		5.3 / 4.6	35		35W-112W
Core Ultra 7 265	8+12 / 20	5.2 / 4.6	33	30MB	65W-182W
Core Ultra 7 265F			25					N/A
Core Ultra 7 265T			33		35W-112W			4 / 8
Core Ultra 5 245	6+8 / 14	5.1 / 4.5	29	24MB	65W-121W
Core Ultra 5 245T					36W-114W
Core Ultra 5 235		5 / 4.4	27		65W-121W			3 / 6
Core Ultra 5 235T					35W-114W
Core Ultra 5 225	6+4 / 10		23	20MB	65W-121W			2 / 4
Core Ultra 5 225F		4.9 / 4.4	19					N/A

The CPUs are built using a mix of cutting-edge process technologies: compute tiles are fabricated on TSMC's N3B node, graphics tiles on N5P, and SoC and I/O tiles on N6. These components are brought together using Intel's Foveros 3D packaging technology. The new Core Ultra 200S processors will officially launch on January 13, offering a broad range of options for consumers seeking a balance between performance and efficiency.